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molded plastic bridge rectifier FUXINSEMI GBU2010 featuring glass passivated chip and halogen free options

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molded plastic bridge rectifier FUXINSEMI GBU2010 featuring glass passivated chip and halogen free options

Non-Repetitive Peak Forward Surge Current : 300A

Operating Junction Temperature Range : -55℃~+150℃

Voltage - Forward(Vf@If) : 1.2V@20A

Current - Rectified : 20A

Voltage - DC Reverse(Vr) : 1kV

Description : Bridge Rectifier 1kV 20A Through Hole GBU

Mfr. Part # : GBU2010

Model Number : GBU2010

Package : GBU

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Product Overview

The GBU series of Glass Passivated Single Phase Bridge Rectifiers offers a reliable and cost-effective solution for rectification applications. Designed for non-automatic and automatic insertion, these rectifiers feature a molded plastic construction for space-saving and low-cost benefits. They are ideal for applications requiring efficient power conversion with a voltage range from 50V to 1000V. The lead-free parts meet RoHS requirements, and suffix "-H" indicates Halogen-free options.

Product Attributes

Brand: Fuxinsemiconductor
Construction: Molded plastic technology
Chip Type: Glass passivated
Flame Retardant: Epoxy UL94-V0 rated
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Marked on body
Mounting Position: Any
Certifications: RoHS compliant (lead-free parts)
Halogen Free: Available with suffix "-H"

Technical Specifications

Symbol	GBU20005	GBU2001	GBU2002	GBU2004	GBU2006	GBU2008	GBU2010	Units
V_RRM	50	100	200	400	600	800	1000	V
V_RWM	50	100	200	400	600	800	1000	VDC
V_RMS	35	70	140	280	420	560	700	V
I_F(AV) (Note 1) @T_C=90C	20.0							A
I_FSM 8.3ms Single half sine-wave	72							A
I²t Rating for fusing (t <8.3ms)	374							As
V_FM @I_F=10A	1.1							V
V_FM @I_F=20A	1.2							V
I_R @Rated DC Blocking Voltage @T_J=25C	5.0							uA
I_R @Rated DC Blocking Voltage @T_J=125C	200							uA
R_JA (Typical)	35							C/W
R_JC (Typical)	5.0							C/W
R_JL (Typical)	2.0							C/W
C_J (Typical) Note 2	100							pF
Dielectric Strength	2500							V_RMS
T_{J, TSTG}	-55 to +150							C
Installation Torque (Max)	8.0							Kgf.cm

Notes:
1. Mounted on glass epoxy PC board with 1.3mm solder pad.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.

2010262106_FUXINSEMI-GBU2010_C908181.pdf

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